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FS273M

The FS273M is an SLM 3D printer from Farsoon Technologies with a 275 x 275 x 355 mm build volume.

The FS273M is an SLM 3D printer from Farsoon Technologies with a 275 x 275 x 355 mm build volume.

Specifications

Farsoon FS273M: Technical Profile

Laser System

Single or dual 500 W fiber laser at 1070 nm. The dual-laser variant covers the full build volume with two independent galvo scanners, cutting build time by ~40% for large flat cross-sections.

Scanner / Optics

Galvanometer scanning system with a maximum speed of 10 m/s. The focused beam enables fine lattice structures and thin walls.

Build Platform

275 × 275 × 355 mm: 35 mm taller than the predecessor FS271M. The build plate can be heated to manage residual stresses in critical alloys.

Chamber and Inert Atmosphere

Sealed build chamber with continuous inert gas flow (Ar or N₂).

Calibration

Calibration Protocol: FS273M

Atmospheric inertness

Before every build, verify O₂ level. Standard alloys: < 100 ppm; Cu, Ti, and refractory metals: < 50 ppm. Purge with argon for at least 15 minutes.

Laser calibration

Use Build Star's automatic beam focus and diameter check at 9 points across the build field. Maximum allowable deviation: 0.05 mm. If exceeded, perform manual galvo-matrix correction.

Platform levelling.

Common defects

Typical Defects and Remedies: FS273M (SLM)

Porosity

Gaseous (spherical) or lack-of-fusion (irregular). Cause: entrapped atmospheric gas or low volumetric energy density (VED). Fix: raise VED, ensure O₂ < 100 ppm, optimise via DOE.

Hot cracking

Common in nickel superalloys (IN718) and refractories. Cause: high thermal gradient → plastic strain during solidification. Fix: preheat build plate (200 °C for IN718), use chess/island scan strategy.

Delamination

Inter-layer separation.

What it is used for

Use Cases: FS273M

Aerospace structural components

Qualified Ti-6Al-4V, IN718, and HAYNES alloys + open parameter access → full AS9100 process qualification. Extended Z (355 mm) covers long structural profiles.

Medical implants (Cu and Ti)

Pure copper support is rare in mid-class SLM; used for antimicrobial surgical instruments and specialised implants.

ManufacturerFarsoon Technologies
TechnologySLM
Classindustrial
Build volume275 x 275 x 355 mm
Layer height20-80 µm
Kinematicsgantry
Enclosureactive
Auto levellingno
Price380 000 EUR
Compatible materialsalsi10mg, ss-316l, ti-6al-4v, inconel-718, cocr, copper

Reference price

Price (EUR)380 000 EUR
NoteReference from the database; no market source or date.

Specifications

ManufacturerFarsoon Technologies
TechnologySLM
Classindustrial
Build volume275 x 275 x 355 mm
Layer height20-80 µm
Kinematicsgantry
Auto levellingno

Compared with 3 similar

same class and kinematics, close in price within 30 percent

ModelClassKinematicsBuild volumePrice (EUR)
FS273M (this)industrialgantry275 x 275 x 355 mm380000
SLM 125industrialgantry125 x 125 x 125 mm380000
FS271Mindustrialgantry275 x 275 x 320 mm350000
TruPrint 1000 Green Editionindustrialgantry420000

Compatible materials and print settings

Material
AlSi10Mg
Stainless Steel 316L
Ti-6Al-4V
Inconel 718
CoCr (Cobalt-Chrome)
Copper (Cu)