JEOL JAM-5200EBM

The JEOL JAM-5200EBM is an EBM 3D printer from JEOL with a 250 x 250 x 400 mm build volume.

Specifications

JEOL JAM-5200EBM: Technical Profile

Electron Beam

6 kW with automatic focus, astigmatism, and positional distortion correction. JEOL brings 70+ years of EB instrument expertise (SEM/TEM). Cathode lifespan ≥ 1500 hours: longest in class at launch.

BSE Monitoring (Unique Capability)

Backscattered Electron sensor inspects every layer in real time, detecting internal defects (porosity, LOF, inclusions) without destructive post-build inspection: technology transferred directly from JEOL SEM instruments.

Optics / Scanner

Automatic astigmatic and positional correction at each build start.

Platform

Build volume Ø250 × 400 mm; standard layer thicknesses 50 µm and 75 µm.

Calibration

JEOL JAM-5200EBM Calibration

Automatic EB Correction

JEOL provides an automated focus/astigmatism/distortion correction procedure: run it at each new material class or after cathode replacement.

Vacuum and e-Shield

Confirm operating pressure; activate e-Shield. This system replaces helium purging, so misconfiguration can lead to a smoke event.

Preheat

Multiple defocused beam scans at low power sinter the powder layer.

Common defects

Typical Defects on JEOL JAM-5200EBM

Porosity

Gas-type: moisture in powder → dry at 120°C/2–4 h before build. LOF: insufficient power → check BSE signal for dark zones.

Smoke Event

Electrostatic charge build-up in powder at insufficient preheat or e-Shield fault. Risk: powder dispersal can damage the focusing lens. Fix: additional preheat cycles; inspect e-Shield hardware.

Solidification Cracking

In alloys with wide solidification range.

What it is used for

Use Cases for JEOL JAM-5200EBM

Aerospace-Qualified Production

AMS7032 certification plus BSE monitoring make the JAM-5200EBM suitable for parts requiring documented zero-defect evidence: no destructive cross-section after build.

Orthopedics and Medical Implants

Ti-6Al-4V Grade 23 in vacuum; porous lattice structures for osseointegration in hip cups, stems, and spinal implants.