The eMELT-iD is an EBM 3D printer from Freemelt with a 100 x 100 x 325 mm build volume.
The eMELT-iD is an EBM 3D printer from Freemelt with a 100 x 100 x 325 mm build volume.
Electron Beam
60 kV acceleration voltage; 0-6 kW continuous beam power. Electromagnetic deflection with high scan speed.
Chamber & Atmosphere
Working pressure <10E-4 mbar (high vacuum) - no inert gas required. Vacuum is essential for reactive metals (Ti, W, Mo).
Platform & Powder Feed
Non-gravity push-piston powder feed handles low-flowability powders. Z-platform stroke 325 mm.
Build Volume
100x100x325 mm cylindrical envelope - identical to eMELT-iM, ensuring true process transfer fidelity.
BSE Monitoring
Backscattered electron detector generates high-contrast layer-by-layer images for in-situ QA.
Software.
Vacuum preparation
Reach <10E-4 mbar; inspect seals when changing BuildUnit or material.
Beam calibration
Focus + stigmator at 60 kV; spot-size verification on a copper calibration plate after each cathode replacement.
Pre-sinter parameters
Set current and scan speed for complete powder sintering - critical to prevent smoke event with new materials.
Process window test cube.
Smoke event (powder charge)
Symptom: visible cloud, abrupt powder loss. Cause: electrostatic charging from insufficient pre-sintering. Fix: increase pre-sinter dose; inspect powder morphology.
Porosity
Spherical (entrapped gas in powder) or irregular (lack of fusion). Fix: use low-gas-content powder; optimise linear energy dose.
Distortion and warping
Curling at low preheat. Fix: raise temperature setpoint; increase contour pre-sinter.
Recoater streaks.
Aerospace alloy qualification
Process transfer fidelity with iM enables AS9100/NADCAP-compatible path without re-qualification.
Medical Ti implants
Porous trabecular structures without supports - EB-PBF's natural powder sintering is ideal for osseointegration.
Nuclear & reactive metals.
| Manufacturer | Freemelt |
|---|---|
| Technology | EBM |
| Class | industrial |
| Build volume | 100 x 100 x 325 mm |
| Layer height | 50-200 µm |
| Enclosure | active |
| Auto levelling | no |
| Price | 750 000 EUR |
| Compatible materials | ti-6al-4v, inconel-718 |
| Price (EUR) | 750 000 EUR |
|---|---|
| Note | Reference from the database; no market source or date. |
| Manufacturer | Freemelt |
|---|---|
| Technology | EBM |
| Class | industrial |
| Build volume | 100 x 100 x 325 mm |
| Layer height | 50-200 µm |
| Auto levelling | no |
same class and kinematics, close in price within 30 percent
| Model | Class | Build volume | Price (EUR) | Kinematics |
|---|---|---|---|---|
| eMELT-iD (this) | industrial | 100 x 100 x 325 mm | 750000 | |
| TADA EZ300 | industrial | 250 x 250 x 300 mm | 720000 | |
| eMELT-iM | industrial | 100 x 100 x 325 mm | 900000 | gantry |
| Freemelt ONE | industrial | 500000 | gantry |
| Material |
|---|
| Ti-6Al-4V |
| Inconel 718 |