eMELT-iM

The eMELT-iM is an EBM 3D printer from Freemelt with a 100 x 100 x 325 mm build volume.

Specifications

Electron Gun: Variable 0–6 kW electron gun; 60 kV; minimum spot size 200 µm FWHP.

Thermal Management, Three Independent Layers:

• ProHeat, indirect preheating of the powder bed before melting
• Pixelmelt, precision point-melting of each voxel
• Active Build Cooling, controlled cool-down after deposition

Build Volume: Cylindrical Ø100 × H325 mm; dockable exchangeable build modules: swap in < 20 min.

Sensors: Backscattered electron detector, pyrometer, NIR camera: three parallel data streams per layer.

Vacuum: Process vacuum 1×10⁻⁵ hPa: better than typical EB-PBF.

Calibration

ProHeat: Optimise indirect preheating parameters for new alloy; start with iD reference OBF.

Pixelmelt: Calibrate spot size independently from ProHeat at different power levels: target ≤ 200 µm FWHP.

Dock/Undock: Verify vacuum seal and electrical contacts after every build module swap.

BSD Verification: Calibrate backscattered electron detector against reference specimen for each new alloy.

Common defects

Smoke Event: Unoptimised ProHeat for new alloy: start with iD parameters, increase current step by step.

LOF Porosity: Low Pixelmelt energy: reduce scan speed, increase beam current.

Solidification Cracking: Add post-build controlled cool-down to OBF; activate Active Build Cooling only in final layers.

Uneven Layer After Dock/Undock: Check dock seal; clean docking interface before every swap.

What it is used for

Serial Medical Implants: Modular swap < 20 min; small volume ideal for dental/orthopaedic components.

Production Transfer from iD: Parameters certified on iD work without re-optimisation: unique EB-PBF feature.

Reactive Metals (Nb, W, TiAl): Fleet Manager + small powder batches = ideal for serial runs of rare alloys.