Farsoon Flight HT252P

The Farsoon Flight HT252P is an SLS 3D printer from Farsoon Technologies with a 250 x 250 x 320 mm build volume.

Specifications

Technical Specifications: Farsoon Flight HT252P

Laser System

The HT252P uses a 60W ytterbium fiber laser at 1064 nm: fundamentally different from standard CO₂ systems (10.6 µm). The fiber laser achieves a focus spot of ~100 µm (vs. ~400 µm for CO₂), delivering higher resolution and more efficient energy coupling into polyamide powders. Fiber laser lifetime exceeds 100,000 hours vs. ~20,000 h for CO₂.

Optics and Scanner

Galvanometric scanner with F-theta lens provides positioning accuracy of ±0.1 mm across the full build area. Maximum scan speed reaches 10 m/s: approximately 2–3× faster than classic CO₂ systems at comparable parameters.

Build Chamber and Platform.

Calibration

Calibration: Farsoon Flight HT252P

Energy Density (ED)

The primary quality parameter for SLS. ED = laser power / (scan speed × hatch spacing × layer thickness). Target value for PA12: 0.04–0.06 J/mm². Below minimum → incomplete sintering; above maximum → powder degradation and yellowing.

Temperature Calibration

Chamber heating is two-phase: pre-heat to ~150°C (1–2 h), then final stabilization at operating temperature (170–175°C for PA12).

Common defects

Defects in SLS: Farsoon Flight HT252P

Orange-Peel

The most common defect in SLS systems with improperly calibrated temperature. Manifests as a rough, uneven surface resembling orange peel. Cause: chamber not sufficiently heated → powder crystallizes before complete melting. Fix: increase temperature by 2–3°C and wait for stabilization before starting.

Incomplete Sintering

Porous, brittle or crumbly parts: visible when broken.

What it is used for

Use Cases: Farsoon Flight HT252P

Functional PA12 Prototypes

The fiber laser provides better absorption in polyamide powders → higher part density (>0.95 g/cm³) and better surface roughness (Ra ~10–15 µm) compared to CO₂ systems. Suitable for mechanically loaded prototypes: brackets, connectors, housings.

Low-Volume Production.