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Thermal Expansion

The tendency of materials to change dimension with temperature, characterized by the coefficient of thermal expansion (CTE), critical for predicting warping and fit changes in printed parts.

Theory

ΔL = α × L₀ × ΔT. Typical polymer CTEs: PLA 68 µm/m·K, ABS 90 µm/m·K, PEEK 47 µm/m·K vs. steel 12 µm/m·K, aluminum 23 µm/m·K. Mismatch in CTE between printed part and metal insert/fastener causes loosening or cracking under thermal cycling. FDM parts are also anisotropic in CTE.

Application

Size clearance fits for the highest operating temperature. For metal inserts in polymer: ΔD = α_polymer × D × ΔT. Heated enclosures (electronics, automotive) need explicit thermal analysis. Minimize warping: use heated bed, enclosure, proper first-layer adhesion, and slow cool-down.

Common mistakes

Ignoring CTE mismatch in multi-material assemblies causes joint failure after thermal cycling. ABS shrinks significantly (~0.8%) during cooling: always use heated bed and enclosure. Bimetallic effect in anisotropic FDM parts causes curvature on cooling if top/bottom layers differ.

Related terms: Clearance Fit, Tolerance, Dimensional Accuracy, Assembly Clearance

Fieldengineering
Also calledCTE, coefficient of thermal expansion, thermal distortion
SourceEDi Brain: rules-core

Engineer, author of The Big Book of 3D Printing and additive manufacturing expert