FDM · Engineering
Last updated: 2026
| Nozzle temperature | 210–230 °C |
| Bed temperature | 55–65 °C |
| Chamber temperature | – (not needed) |
| Layer height | 0.12–0.24 mm |
| Retraction | 1.2 mm at 35 mm/s |
| Cooling fan | 80% |
| Infill | 30% |
| Bed adhesion | skirt |
| Enclosure | no |
| Hardened nozzle | no |
| All-metal hotend | no |
| Popular brands | Polymaker PolyMax, Bambu PLA Tough, eSUN PLA+ |
Nozzle 210–230°C, bed 55–65°C, fan 80%.
Retraction 1.2 mm at 35 mm/s. Layer height 0.12–0.24 mm, infill 30%.
No: PLA Pro / PLA+ prints fine without an enclosure.